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Best Price Silver Tungsten Alloy Plate Customization Tungsten Plate High Temperature Resistance
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xProduct Details
| Heat Conductivity | 0.13 W/mK | Composition | 99.95% |
|---|---|---|---|
| Electrical Conductivity | 31.1% IACS | Meltiing Point | 3410℃ |
| Market | Global | Chemical Composition | Co-WC |
| Standard | ASTM B760-2007 GB/T 3875-2006 | Elongation | ≥10% |
| High Light | High temperature Silver tungsten alloy plate,customization Silver tungsten alloy plate,Best price Silver tungsten alloy plate |
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Product Description
1,Description:
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Material: Tungsten Plates are made of tungsten, a refractory metal known for its exceptional high melting point, excellent mechanical properties, and resistance to corrosion. Tungsten is commonly used in applications requiring high-temperature stability and durability.
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Shape and Structure: Tungsten Plates have a flat and rectangular shape with uniform thickness. They can be customized in terms of dimensions and thickness to suit specific application requirements.
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High Melting Point: Tungsten has one of the highest melting points among all metals, with a melting point of 3,422°C (6,192°F). Tungsten Plates can withstand extremely high temperatures without deformation or softening, making them suitable for use in high-temperature environments.
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Density: Tungsten has a high density, and as a result, Tungsten Plates exhibit a high density in the range of 17.6 - 19.3 g/cm³. This high density provides excellent radiation shielding properties and makes them suitable for applications requiring high mass and stability.
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Mechanical Strength: Tungsten Plates possess exceptional mechanical strength, high tensile strength, and good hardness. They exhibit low thermal expansion and have high modulus of elasticity, providing structural stability and resistance to deformation.
2,Specifications:
| Physical Property | Description |
|---|---|
| Material | Tungsten |
| Melting Point | 3,422°C (6,192°F) |
| Density | 17.6 - 19.3 g/cm³ |
| Thermal Conductivity | 162 - 174 W/m·K |
| Coefficient of Thermal Expansion | 4.5 - 5.4 x 10^-6 /K |
| Electrical Conductivity | 31% IACS (International Annealed Copper Standard) |
| Tensile Strength | 550 - 900 MPa (at room temperature) |
| Yield Strength | 350 - 700 MPa (at room temperature) |
| Hardness | 250 - 300 HV |
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