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99.95% Pure Tungsten Products 750 MPa Tungsten Ring For Semiconductor

Model Number Tungsten Ring
Minimum Order Quantity Negotiate
Price Negitionable
Packaging Details Standard export cartons
Delivery Time 30 days after receiving down payment
Payment Terms L/C, D/A, D/P, T/T
Supply Ability 10000sets/month

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Product Details
Name Tungsten Ring Molecular Weight 183.85
Melting Point 3410 °C Density 19.3 G/cm3
Application Semiconductor, Chemical Vapor Deposition (CVD) Tensile Strength 750 MPa
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Product Description

99.95% Pure Tungsten Products Tungsten Ring For Semiconductor

 

Introduction

 

Grade: W 1
Purity: > 99.95%
Density: 17.1 g / cm 3-19.3 g / cm 3
Size: Diameter > 10 mm * thick > 0.1 mm
Processing technique: cold rolled/machined
Surface: polished surface /machined surface
Color: metal color
Condition: vacuum annealing
Melting point: 3410 degree
Boiling point: 5927 degree
Delivery time: 3-10 days

 

Parameter

 

Molecular Weight

183.85

Appearance

Silvery

Melting Point

3410 °C

Boiling Point

5900 °C

Density

19.3 g/cm3

Solubility in H2O

N/A

Electrical Resistivity

5.65 μΩ ·m (27 °C)

Electronegativity

1.7 Paulings

Heat of Fusion

35.3 kJ/mol

Heat of Vaporization

806.7 kJ/mol

Poisson's Ratio

0.28

Specific Heat

0.133 J/g mol (20 °C)

Tensile Strength

750 MPa

Thermal Conductivity

1.73 W/m K

Thermal Expansion

(25 °C) 4.5 µm·m-1·K-1

Vickers Hardness

3430 MPa

Young's Modulus

411 GPa

 

Tungsten Ring Applications

 

1. widely used in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications;

2. applied in producing electrodes, heating elements, heat shields, sintering trays, sintering boats, stacking sheets, base plates, sputtering targets, crucibles in electronic and vacuum applications.

3. can be used as contacts in vehicle motors.