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High-Performance CuW70 Tungsten Copper Alloy Disc Precision Polished for Industry

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xChemical Composition | W75 Cu25 | Cobalt Content | 6-8% |
---|---|---|---|
Density | 14.5 G/cm3 | Electrical Conductivity | 25-35% IACS |
Meltingpoint | 1495℃ | Surface | Polished |
Thermalconductivity | 90 W/m·K | Yield Strength | >1000MPa |
1,Description:
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Tungsten Copper Alloy Disc: A Fusion of Strength and Conductivity
A Tungsten Copper Alloy Disc represents a sophisticated solution in material engineering, designed to excel in environments where high thermal conductivity, electrical conductivity, and exceptional durability are paramount. This disc, characterized by its round shape, is meticulously crafted through the fusion of tungsten and copper, two metals renowned for their distinct properties.
Composition and Customization: The disc's composition is carefully engineered, featuring tungsten concentrations typically ranging from 50% to 90%. The balance is comprised of copper, which contributes significantly to the alloy's conductivity. This versatile ratio can be adjusted to meet the specific demands of various applications, ensuring optimal performance while considering cost-effectiveness.
Performance Attributes: The synergistic blend of tungsten and copper endows these discs with superior thermal and electrical conductivity. The copper component facilitates high levels of conductivity, making these alloys indispensable in applications requiring efficient heat dissipation or robust electrical connections. They are ideal for use as heat sinks, electrical contacts, and electrodes in industries where precision and reliability are critical.
In summary, a Tungsten Copper Alloy Disc is not merely a material; it is a strategic choice for engineers seeking a durable, conductive, and adaptable solution for high-performance applications.
2,Specifications:
Property | Value (Unit) |
---|---|
Composition | Typically 50-90% Tungsten, 10-50% Copper |
Density | 14.0-16.5 g/cm³ |
Melting Point | 3,000-3,400 degrees Celsius |
Electrical Conductivity | 20-45% IACS |
Thermal Conductivity | 180-230 W/m·K |
Coefficient of Thermal Expansion | 6.5-9.0 x 10^-6 per degree Celsius |
Young's Modulus | 250-320 GPa |
Hardness (Vickers) | 200-300 HV |
Tensile Strength | 600-900 MPa |
Elongation at Break | 3-15% |