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Tungsten Copper Alloy Materials Electronic Packaging Base Flanges

  • Tungsten Copper Alloy Materials Electronic Packaging Base Flanges
  • Tungsten Copper Alloy Materials Electronic Packaging Base Flanges
  • Tungsten Copper Alloy Materials Electronic Packaging Base Flanges
  • Tungsten Copper Alloy Materials Electronic Packaging Base Flanges
  • Tungsten Copper Alloy Materials Electronic Packaging Base Flanges
Place of Origin China
Brand Name Hypersolid Metal
Minimum Order Quantity Negotiate
Price Negitionable
Packaging Details Standard export cartons
Delivery Time 30 days after receiving down payment
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 10000sets/month

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Product Details
Density 14.5 G/cm3 Thermalconductivity 90 W/m·K
Shape Plate And Sheet Hardness 250-300 HB
Cobalt Content 6-8% Impact Toughness ≥2.5J/cm2
Material Tungsten And Copper Original China
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Product Description

Tungsten Copper Alloy Materials Electronic Packaging Base Flanges 0

 

Tungsten Copper Alloy Sheets: A Fusion of Strength and Conductivity

Innovative engineering solutions often demand materials that can perform under the most challenging conditions. Tungsten Copper Alloy sheets offer a compelling blend of tungsten's robust characteristics with copper's superior conductive abilities, making them indispensable across a wide range of industries.

These sheets harness the power of tungsten, known for its unparalleled density and extraordinary strength. With one of the highest melting points in the metallic world, tungsten ensures that the alloy can resist deformation even in the face of extreme temperatures. This makes the alloy particularly suitable for environments where thermal stability is critical, such as in advanced aerospace components and high-performance electronics.

2,Specifications:

 

Physical Property Description
Composition Tungsten (W) and Copper (Cu)
Density Typically ranges from 13.5 to 16.5 g/cm³
Melting Point Approximately 3400°C (6150°F) for pure tungsten
Thermal Conductivity Ranges from 180 to 230 W/(m·K)
Electrical Conductivity Ranges from 20 to 60% IACS (International Annealed Copper Standard)
Hardness Typically ranges from 200 to 300 HB (Brinell Hardness)

 

 

Tungsten Copper Alloy Materials Electronic Packaging Base Flanges 1