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Tungsten Copper Sheet Tungsten Copper Alloy Plate Vacuum Furnace Alloy Refractory Metal
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xProduct Details
| Meltingpoint | 1495℃ | Fracturetoughness | 2.5 MPa·m1/2 |
|---|---|---|---|
| Alloy Type | WCu | Tensile Strength | 800-1000 MPa |
| Melting Point | 3420°C | Density | 15.63 G/cm3 |
| Thermal Conductivity | 180-200 W/m·K | Material | Tungsten Copper Alloy |
| High Light | Vacuum furnace alloy tungsten copper sheet,Refractory metal tungsten copper sheet |
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Product Description
1,Description:
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Material: Tungsten copper alloy plates are composed of a mixture of tungsten and copper. The alloy combines the high strength and thermal conductivity of tungsten with the excellent electrical conductivity of copper.
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Composition: Tungsten copper alloy plates typically have a tungsten content ranging from 70% to 90%, with the remaining portion being copper. Different compositions can be tailored to meet specific requirements for thermal and electrical properties.
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High Strength: Tungsten copper alloy plates exhibit high strength and hardness, making them suitable for applications requiring resistance to wear, deformation, and high mechanical stresses.
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Thermal Conductivity: Tungsten copper alloy plates possess good thermal conductivity, allowing for efficient heat dissipation and thermal management in various applications.
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Electrical Conductivity: Tungsten copper alloy plates have excellent electrical conductivity, making them suitable for electrical and electronic applications that require both high strength and good electrical performance.
2,Specifications:
| Physical Property | Description |
|---|---|
| Composition | Tungsten and copper alloy |
| Tungsten Content | 70% - 90% |
| Copper Content | 10% - 30% |
| Density | 14.0 - 16.5 g/cm³ |
| Hardness | 200 - 400 HB (Brinell Hardness) |
| Thermal Conductivity | 180 - 230 W/m·K |
| Electrical Conductivity | 25 - 90% IACS (International Annealed Copper Standard) |
| Coefficient of Thermal Expansion | 6.5 - 9.0 x 10^-6 /K |
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