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Molybdenum Disc
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xProduct Details
| Name | Molybdenum Ring&Disc | Density | ≥10.2g/cc |
|---|---|---|---|
| Melting Point | 2610ºC | Application | Silicon Controlled Rectifier Diodes, Transistors |
| Advantage | High Temperature Resistance | Size | Customized |
Product Description
Molybdenum Ring&Disc
Quick Details
Material: pure molybdenum 99.95%Min
Density10.2g/cc
Melting point: 2610C
We can manufacture according to customer required
Excellent conductivity of electricity
Resistance of high temperature
High melting point, high oxidation and erosion resistance.
Chemical requirements
|
Element |
Ni |
Mg |
Fe |
Pb |
Al |
Bi |
Si |
Cd |
Ca |
P |
|
Concentration(%) |
0.003 |
0.002 |
0.005 |
0.0001 |
0.002 |
0.0001 |
0.002 |
0.0001 |
0.002 |
0.001 |
|
Element |
C |
O |
N |
Sb |
Sn |
Mo |
|
|
|
|
|
Concentration(%) |
0.01 |
0.003 |
0.003 |
0.0005 |
0.0001 |
balance |
|
|
|
|
Parameters
|
Atomic number |
42 |
|
CAS number |
7439-98-7 |
|
Atomic mass |
95.94 [g/mol] |
|
Melting point |
2620 °C |
|
Boiling point |
4639 °C |
|
Density at 20 °C |
10.22 [g/cm] |
|
Crystal structure |
Body-centered cubic |
|
Coefficient of linear thermal expansion at 20 °C |
5.210-6 [m/(mK)] |
|
Thermal conductivity at 20 °C |
142 [W/(mK)] |
|
Specific heat at 20 °C |
0.25 [J/(gK)] |
|
Electrical conductivity at 20 °C |
17.9106 [S/m] |
|
Specific electrical resistance at 20 °C |
0.056 [(mm2)/m] |
Applications
Molybdenum rings are widely used as contact materials in silicon controlled rectifier diodes, transistors and thyristors mounting material for power semiconductor devices and heat sink bases.
Features
1. Molybdenum discs are widely used as contact materials in diodes of silicon controlled rectifiers, transistors and thyristors;
2. Further applications include using molybdenum discs as heat sink bases in IC'S, LSI'S and hybrid circuits;
3. Molybdenum discs are widely used in vacuum switches as contact terminals.;
4. Molybdenum discs are also applied in producing heating sintering trays, sintering boats, base plates, supporting disk for
crucibles in electronic and vacuum applications. disc/round
5. Used as sputtering targets.
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